| Customization: | Available |
|---|---|
| Certification: | RoHS |
| Color: | Green |
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| No. | Items | Unit | Ultra-P Grade | Production Grade | Research Grade | Dummy Grade |
| 1.Boule Parameters | ||||||
| 1.1 | Poly type | -- | 4H | |||
| 1.2 | Surface orientation error | ° | 4° toward <11-20>±0.15° | 4° toward <11-20>±0.5° | 4° toward <11-20>±0.5° | 4° toward <11-20>±0.5° |
| 2.Electrical Parameters | ||||||
| 2.1 | dopant | cm-³ | n-type Nitrogen | |||
| 2.2 | resistivity | ohm ·cm | 0.016~0.024ohm ·cm | 0.015~0.025ohm ·cm | 0.015~0.025ohm ·cm | NA |
| 3.Mechanical Parameters | ||||||
| 3.1 | diameter | mm | 150 ±0.25 mm | |||
| 3.2 | Thickness | μm | 350±25μm | |||
| 3.3 | Primary flat orientation | ° | [1-100]±5° | |||
| 3.4 | Primary flat length | mm | 47.5±1.5mm | 47.5±2.5mm | 47.5±2.5mm | 47.5±2.5mm |
| 3.5 | LTV | μm | ≤2μm(10mm*10mm) | ≤5μm(10mm*10mm) | ≤10μm(10mm*10mm) | ≤15μm(10mm*10mm) |
| 3.6 | TTV | μm | ≤5μm | ≤10 μm | ≤15 μm | ≤20 μm |
| 3.7 | Bow | μm | -15 μm~15 μm | -25 μm~25 μm | -45 μm~45 μm | -65 μm~65 μm |
| 3.8 | Warp | μm | ≤20μm | ≤35μm | ≤50μm | ≤70μm |
| 3.9 | (AFM)Front(Si-face)Roughness | nm | Ra≤0.2nm | Ra≤0.2nm | Ra≤0.2nm | Ra≤0.2nm |
| 4.Structure | ||||||
| 4.1 | micropipe density | ea/cm² | ≤0.15 ea/cm² | ≤0.5 ea/cm² | ≤1 ea/cm² | ≤2 ea/cm² |
| 4.2 | metal content | atoms/cm² | ≤5E10 atoms/cm² | ≤1E11 atoms/cm² | ≤1E11 atoms/cm² | NA |
| 4.3 | TSD | ea/cm² | ≤100ea/cm² | ≤300ea/cm² | ≤500ea/cm² | NA |
| 4.4 | BPD | ea/cm² | ≤600ea/cm² | ≤1000ea/cm² | ≤1500ea/cm² | NA |
| 5.Front Quality | ||||||
| 5.1 | front | -- | Si | Si | Si | Si |
| 5.2 | surface finish | -- | Si-face CMP | Si-face CMP | Si-face CMP | Si-face CMP |
| 5.3 | particle | ea/wafer | ≤60(size≥0.3 μm) | ≤100(size≥0.3 μm) | NA | NA |
| 5.4 | scratches | ea/mm | ≤2,Total Length≤1/2*Diameter | ≤5,Total Length≤Diameter | NA | NA |
| 5.5 | chips/indents/cracks/stai | -- | None | None | None | NA |
| 5.6 | Polytype areas | -- | None | ≤0.5%Cumulative area) | ≤2%Cumulative area) | ≤5%Cumulative area) |
| 5.7 | front marking | -- | None | None | None | None |
| 6.Back Quality | ||||||
| 6.1 | back finish | -- | C-face polished | |||
| 6.2 | scratches | ea/mm | ≤5,Total Length≤Diameter | NA | NA | NA |
| 6.3 | Back defects edge | -- | None | None | None | NA |
| 6.4 | Back roughness | nm | Ra≤0.2nm(5μm*5μm) | Ra ≤5nm | Ra ≤5nm | Ra ≤5nm |
| 7.Edge | ||||||
| 7.1 | Wafer Edge | -- | Chamfer | Chamfer | Chamfer | Chamfer |
| 8.Packaging | ||||||
| 8.1 | Packaging | -- | Epi-ready with vacuum packaging | |||
| 8.2 | Packaging | -- | Multi-waferorSingle wafer cassette packaging | |||
| SEMI-STDNotes:"NA"means no request.Items not metioned may refer to SEMI-STD. | ||||||
Q1: What's the way of shipping ?
A: We accept DHL, Fedex, TNT, UPS, EMS, SF and etc.
Q2: How to pay?
A: T/T, PayPal and etc..
Q3: What's the deliver time?
A: For inventory: the delivery time is 10 workdays. For customized products: the delivery time is 10to 25 workdays. According to the quantity.
Q4: Can I customize the products based on my need?
A: Yes, we can customize the specifications according to your needs.
Q5: How to guarantee the quality of your products?
A: Strict detection during production.Strict sampling inspection on products before shipment and intact product packaging ensured.
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